The development trend of embedded passive components

被引:0
|
作者
机构
[1] Aoki, Masashi
来源
Aoki, M. | 1600年 / Japan Institute of Electronics Packaging, 4F Toranomon Sangyo Bldg. 2-29, Toranomon 1-chome, Minato-ku, Tokyo, 105-0001, Japan卷 / 15期
关键词
D O I
10.5104/jiep.15.522
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] The development trend of embedded passive components
    Aoki, Masashi, 1600, Japan Institute of Electronics Packaging (17):
  • [2] Embedded passive components for MCM
    Golonka, LJ
    Wolter, KJ
    Dziedzic, A
    Kita, J
    Rebenklau, L
    24TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY: CONCURRENT ENGINEERING IN ELECTRONIC PACKAGING, CONFERENCE PROCEEDINGS, 2001, : 73 - 77
  • [3] Lasers trim embedded passive components
    Watts, M
    PHOTONICS SPECTRA, 2003, 37 (07) : 74 - 76
  • [4] Development of a design library for embedded passive RF components in HDI organic substrate material
    Sommer, G
    Petras, M
    Mohamadou, B
    Salhi, F
    Korf, S
    Fotheringham, G
    Henderson, R
    Blood, W
    Hwang, LT
    Croswell, R
    Lempkowski, R
    Savic, J
    Miller, M
    John, W
    Reichl, H
    2003 IEEE International Symposium on Electromagnetic Compatibility (EMC), Vols 1 and 2, Symposium Record, 2003, : 852 - 855
  • [5] Flexible wireless wearable sensor with embedded passive components
    Vatanparast, Ramin
    Hashizume, Kenichi
    Kitaura, Hiroharu
    Mori, Eigo
    2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 8 - +
  • [6] Embedded passive components for improved power plane decoupling
    Cauwe, Maarten
    De Baets, Johan
    Stahr, Johannes
    Grivon, Arnaud
    Amedeo, Alexandre
    2014 IEEE 18TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2014,
  • [7] Embedded passive components - A challenge for RF design tools
    Cofield, J
    2000 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, 2000, 4217 : 188 - 191
  • [8] Embedded passive components for printed-circuit boards
    Wu, LK
    Tseng, BC
    Liao, LC
    1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1999, 3906 : 499 - 504
  • [9] MCM-D with embedded active and passive components
    Topper, M
    Wolf, J
    Glaw, V
    Buschick, K
    Dabek, A
    Dietrich, L
    Ehrmann, O
    Reichl, H
    1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 224 - 229
  • [10] Optimal design of embedded passive components for RF circuits in LTCC
    Nijhawan, Anmol
    Sinha, Santanu
    Singh, Harimohan
    Kumar, Punam Pradeep
    Bhattacharya, A. N.
    2021 IEEE MTT-S INTERNATIONAL MICROWAVE AND RF CONFERENCE (IMARC), 2021,