Using Components Performance Off-Chip & to Reduce Passive Maximize Cost GaN

被引:0
|
作者
Demcko, Ron [1 ]
West, Daniel [1 ]
机构
[1] AVX Corporation, Greenville,SC, United States
来源
Microwave Journal | 2021年 / 64卷 / 10期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:22 / 36
相关论文
共 50 条
  • [1] Using Off-Chip Passive Components to Maximize GaN Performance & Reduce Cost
    Demcko, Ron
    West, Daniel
    MICROWAVE JOURNAL, 2021, 64 (10) : 22 - 36
  • [2] Accurate Constant Transconductance Generation Without Off-chip Components
    Mondal, Imon
    Krishnapura, Nagendra
    2015 28TH INTERNATIONAL CONFERENCE ON VLSI DESIGN (VLSID), 2015, : 249 - 253
  • [3] IMPROVED PERFORMANCE CMOS OFF-CHIP DRIVER.
    Anon
    IBM technical disclosure bulletin, 1986, 28 (09): : 3970 - 3971
  • [4] Demodulation based testing of off-chip driver performance
    Daehn, W
    ETW 2001: IEEE EUROPEAN TEST WORKSHOP, PROCEEDINGS, 2001, : 42 - 47
  • [5] Constant-gm Bias Circuit without Off-Chip Components
    Shen, Yongjian
    Zhang, Ran
    2016 13TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2016, : 1309 - 1311
  • [6] Operating frequency trends for high performance off-chip buses
    Katopis, George A.
    IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 1999, : 37 - 41
  • [7] VLSI PERFORMANCE COMPENSATION FOR OFF-CHIP DRIVERS AND CLOCK GENERATION
    COX, DT
    GUERTIN, DL
    JOHNSON, CL
    RUDOLPH, BG
    WILLIAMS, RR
    PIRO, RA
    STOUT, DW
    PROCEEDINGS OF THE IEEE 1989 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 1989, : 377 - 380
  • [8] An Analytical Performance Model for Partitioning Off-Chip Memory Bandwidth
    Wang, Ruisheng
    Chen, Lizhong
    Pinkston, Timothy Mark
    IEEE 27TH INTERNATIONAL PARALLEL AND DISTRIBUTED PROCESSING SYMPOSIUM (IPDPS 2013), 2013, : 165 - 176
  • [9] Using Switchable Pins to Increase Off-Chip Bandwidth in Chip-Multiprocessors
    Chen, Shaoming
    Irving, Samuel
    Peng, Lu
    Hu, Yue
    Zhang, Ying
    Srivastava, Ashok
    IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS, 2017, 28 (01) : 274 - 289
  • [10] A heterogeneous array of off-chip interconnects for optimum mechanical and electrical performance
    Kacker, Karan
    Sokol, Thomas
    Yun, Wansuk
    Swaminathan, Madhavan
    Sitaraman, Suresh K.
    JOURNAL OF ELECTRONIC PACKAGING, 2007, 129 (04) : 460 - 468