Thermal analysis of a generalized step-up/step-down Fibonacci DC-DC converter

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[1] Eguchi, Kei
[2] Shimoji, Motoki
[3] Hirata, Satsuki
[4] Oota, Ichirou
[5] Terada, Shinya
[6] Sasaki, Hirofumi
来源
Eguchi, K. (eguti@fit.ac.jp) | 1600年 / ICIC Express Letters Office, Tokai University, Kumamoto Campus, 9-1-1, Toroku, Kumamoto, 862-8652, Japan卷 / 07期
关键词
Boost converter - SPICE - Electric inverters - Thermoanalysis - Integrated circuits - Semiconductor junctions;
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摘要
In this paper, a step-up/step-down k (= 2,3,&middot&middot&middot)-Fibonacci DC-DC converter and its thermal analysis method are discussed. Unlike conventional Fibonacci step-up converter, the proposed converter achieves the k-Fibonacci step-up/step-down ratios. Furthermore, the thermal behavior of the proposed converter is analyzed theoretically, because thermal effect has not been taken into account in the conventional Fibonacci converters. Through simulation program with integrated circuit emphasis (SPICE) simulations and theoretical analyses, the following results are shown: 1. The proposed converter can achieve not only higher step-up/step-down conversion ratios but also more various kinds of output voltages than conventional converters; 2. The power efficiency decreases according to the rise of the surface temperature of IC, because the SC resistance is proportional to the on-resistance of MOS-switch. © 2013 ICIC International.
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