共 13 条
- [1] Bar-Cohen A., Thermal frontiers in the design and packaging of microelectronic, Equipment Mechanical Engineering, 105, pp. 53-59, (1983)
- [2] Yeh L.T., Review of heat transfer technologies in electronicequipment, Journal of Electronic Packaging, 117, pp. 333-339, (1995)
- [3] Fang L., Wu C., Qian R., Et al., Nano-micro structure offunctionalized boron nitride and aluminum for epoxy composites with enhanced thermal conductivity and breakdown strength, RSC Advances, 4, pp. 21010-21017, (2014)
- [4] Hong J.P., Yoon S.W., Hwang T., Et al., High thermal conductivityepoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers, Thermochimica Acta, 537, pp. 70-75, (2012)
- [5] Ishida H., Rimdusit S., Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine, Thermochimica Acta, 320, pp. 177-186, (1998)
- [6] Zhu H., Li Y., Fang Z., Et al., Highly thermally conductive papers with percolative layered boron nitride nanosheets, ACS Nano, 8, pp. 3606-3613, (2014)
- [7] Mehling H., Latent heat storage with a PCM-graphite composite material: experimental results from the first test stor, (2000)
- [8] Li W.W., Study on high thermal conductive phase change materials and thermal control, (2017)
- [9] Shao W.L., Study on surface stickiness of thermal silicone pads, (2014)
- [10] Wang M., Qin Z.F., Aging mechanism of polymer materials and its control, Chemical Engineering Design Communications, 43, 1, pp. 46-47, (2017)