Test and analysis on heat transfer performance of the loop heat pipe

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[1] Wang, Yi-Wei
[2] Cen, Ji-Wen
[3] Jiang, Fang-Ming
[4] Zhu, Xiong
[5] Liu, Pei
来源：
Jiang, F.-M. (jiangfm@ms.giec.ac.c) | 1688年 / Board of Optronics Lasers, No. 47 Yang-Liu-Qing Ying-Jian Road, Tian-Jin City, 300380, China卷 / 24期
关键词：
Electronic cooling - Electronics packaging - Fluids - Heat resistance - Heat transfer - Thermal load - Vapors;
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