Effect of formic acid surface modification on bond strength of solid-state bonded interface of tin and copper

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Graduate School of Engineering, Gunma University, Kiryu 376-8515, Japan ^{[1
]}

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Mater. Trans. | / 10卷 / 1759-1763期

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摘要：

Tin

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[1] Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper
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