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- [1] Electromigration in SnPb and Pb-free solder bumps 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 974 - 978
- [2] Failure mechanisms of SnPb and Pb-free flip chip solder interconnects under tensile stress PROCEEDINGS OF THE SEM IX INTERNATIONAL CONGRESS ON EXPERIMENTAL MECHANICS, 2000, : 616 - 619
- [3] An evaluation of electromigration performance of SnPb and Pb-free flip chip solder joints 55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 1431 - 1436
- [4] Emerging issues in the physics and control of electromigration in SnPb and Pb-free solder bumps PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 72 - 76
- [6] Evaluation of environmental and biological impact of Pb-free solder 2003 3RD INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING - ECODESIGN '03, 2003, : 829 - 830
- [7] Evaluation of environmental and biological impact of Pb-free solder Electronics Goes Green 2004 (Plus): Driving Forces for Future Electronics, Proceedings, 2004, : 421 - 426
- [8] Mechanical properties of Pb-free SnAg solder joints ACTA MATERIALIA, 2011, 59 (07) : 2731 - 2741
- [9] Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 474 - +