Packaging at wafer level for multi cellular power converters

被引：0
|
作者：
Packaging à l'échelle du wafer pour les semi-conducteurs de puissance dans les convertisseurs multicellulaires
机构：
[1] Rouger, Nicolas
[2] Benaissa, Lamine
[3] Widiez, Julie
[4] Lafond, Dominique
[5] Vagnon, Éric
[6] Gaude, Victor
[7] Crébier, Jean-Christophe
来源：
| 1600年 / Lavoisier卷 / 16期
关键词：
Silicon wafers;
D O I：
10.3166/EJEE.16.307-322
中图分类号：
学科分类号：
摘要：
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页码：3 / 4
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