共 40 条
- [1] Thermal Characteristics of High-Power LED Packages with Dissipation Film ADVANCED DESIGN AND MANUFACTURING TECHNOLOGY III, PTS 1-4, 2013, 397-400 : 1767 - 1771
- [3] Experimental and Numerical Study on Thermal Characteristics of High-power LED Street Lamp THERMAL, POWER AND ELECTRICAL ENGINEERING, PTS 1 AND 2, 2013, 732-733 : 161 - 164
- [4] Thermal Resistance and Reliability of High-Power LED Packages Under WHTOL and Thermal Shock Tests IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 33 (04): : 738 - 746
- [6] A STUDY OF THERMAL REGIME IN THE HIGH-POWER LED ARRAYS ST PETERSBURG POLYTECHNIC UNIVERSITY JOURNAL-PHYSICS AND MATHEMATICS, 2018, 11 (03): : 39 - 51
- [8] Research on microstructures of high-power LED chip based on rapid thermal impact 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2020,
- [9] Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (07): : 1254 - 1262
- [10] Thermal study on high-power white LED down light ADVANCED DESIGN TECHNOLOGY, PTS 1-3, 2011, 308-310 : 2531 - +