Structure optimization design of BGA solder joints based on surface response method

[1] Wang Jianpei, Huang Chunyue, Liang Ying, Et al., Thermal stress analysis and optimization of BGA solder joint power load based on regression analysis and genetic algorithm, Chinese Journal of Electronics, 47, 3, pp. 734-740, (2019)

[2] Matjaz Mrsnik, Janko Slavic, Miha Boltezar, Multiaxial vibration fatigue—A theoretical and experimental comparison[J], Mechanical Systems and Signal Processing, 76, pp. 409-423, (2016)

[3] Xia Jiang, Yang Lin, Liu Qunxing, Et al., Comparison of fatigue life prediction methods for solder joints under random vibration loading, Microelectronics Reliability, 95, pp. 58-64, (2019)

[4] Xia Jiang, Li Guoyuan, Li Bin, Et al., Optimal design for vibration reliability of package-on-package assembly using FEA and taguchi method, IEEE Transactions on Components, Packaging and Manufacturing Technology, 6, 10, pp. 1482-1487, (2016)

[5] Han Lishuai, Huang Chunyue, Liang Ying, Et al., Random vibration stress-strain analysis of 3D packaging microscale CSP solder joints, Transactions of the China Welding Institution, 40, 6, pp. 64-70, (2019)

[6] Huang Chunyue, Zhao Shengjun, Liang Ying, Et al., Analysis and prediction of post-welding residual stress in CSP solder joints, Journal of University of Electronic Science and Technology of China, 50, 1, pp. 148-154, (2021)

[7] Minjin Cho, Kim Sujin, Soo Joun Man, Optimal process design of an optimal, single-stage, symmetrical L-bending process employing taguchi method with finite element method, and experimental verification thereof[J], International Journal of Precision Engineering and Manufacturing, 23, 4, pp. 395-404, (2022)

[8] Zhang Z-H, Wang X-S, Ren H-H, Et al., Simulation study on thermo-fatigue failure behavior of solder joints in PoP structure[J], Microelectronics Reliability, 75, pp. 127-134, (2017)

[9] Liang Z, Xue S, Gao L, Et al., Thermal Fatigue Behavior of SnAgCu Soldered Joints in Fine Pitch Devices[J], Rare Metal Materials and Engineering, 39, 3, pp. 382-387, (2010)

[1] Wang Jianpei, Huang Chunyue, Liang Ying, Et al., Thermal stress analysis and optimization of BGA solder joint power load based on regression analysis and genetic algorithm, Chinese Journal of Electronics, 47, 3, pp. 734-740, (2019)

[2] Matjaz Mrsnik, Janko Slavic, Miha Boltezar, Multiaxial vibration fatigue—A theoretical and experimental comparison[J], Mechanical Systems and Signal Processing, 76, pp. 409-423, (2016)

[3] Xia Jiang, Yang Lin, Liu Qunxing, Et al., Comparison of fatigue life prediction methods for solder joints under random vibration loading, Microelectronics Reliability, 95, pp. 58-64, (2019)

[4] Xia Jiang, Li Guoyuan, Li Bin, Et al., Optimal design for vibration reliability of package-on-package assembly using FEA and taguchi method, IEEE Transactions on Components, Packaging and Manufacturing Technology, 6, 10, pp. 1482-1487, (2016)

[5] Han Lishuai, Huang Chunyue, Liang Ying, Et al., Random vibration stress-strain analysis of 3D packaging microscale CSP solder joints, Transactions of the China Welding Institution, 40, 6, pp. 64-70, (2019)

[6] Huang Chunyue, Zhao Shengjun, Liang Ying, Et al., Analysis and prediction of post-welding residual stress in CSP solder joints, Journal of University of Electronic Science and Technology of China, 50, 1, pp. 148-154, (2021)

[7] Minjin Cho, Kim Sujin, Soo Joun Man, Optimal process design of an optimal, single-stage, symmetrical L-bending process employing taguchi method with finite element method, and experimental verification thereof[J], International Journal of Precision Engineering and Manufacturing, 23, 4, pp. 395-404, (2022)

[8] Zhang Z-H, Wang X-S, Ren H-H, Et al., Simulation study on thermo-fatigue failure behavior of solder joints in PoP structure[J], Microelectronics Reliability, 75, pp. 127-134, (2017)

[9] Liang Z, Xue S, Gao L, Et al., Thermal Fatigue Behavior of SnAgCu Soldered Joints in Fine Pitch Devices[J], Rare Metal Materials and Engineering, 39, 3, pp. 382-387, (2010)