Application of viscoplastic-creep separate constitutive model to lead-free solder alloys

被引：0
|
作者：
Hayashi, Takeharu [1 ]
Ebihara, Yoshinori [1 ]
Asai, Tatsuhiko [1 ]
Watanabe, Hirohiko [1 ]
机构：
[1] Tokyo Metropolitan Koganei Technical High School, Hon-cho 6-8-9, Koganei-shi, Tokyo, 184-8501, Japan
来源：
Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A | 2011年 / 77卷 / 780期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Stress relaxation
引用
收藏
页码：1169 / 1177
相关论文
共 50 条
  • [1] A viscoplastic constitutive model and estimation method of material constants for lead-free solder alloys
    Ohguchi, Ken-ichi
    Sasaki, Katsuhiko
    Advances in Electronic Packaging 2005, Pts A-C, 2005, : 1791 - 1796
  • [2] A cyclic viscoplastic and creep damage model for lead free solder alloys
    Kuna, M.
    Wippler, S.
    ENGINEERING FRACTURE MECHANICS, 2010, 77 (18) : 3635 - 3647
  • [3] A practical viscoplastic damage model for lead-free solder
    Fossum, AF
    Vianco, PT
    Neilsen, MK
    Pierce, DM
    JOURNAL OF ELECTRONIC PACKAGING, 2006, 128 (01) : 71 - 81
  • [4] Constitutive and damage model for a lead-free solder
    Wen, SM
    Keer, LM
    Mavoori, H
    JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1190 - 1196
  • [5] Constitutive and damage model for a lead-free solder
    Shengmin Wen
    Leon M. Keer
    Hareesh Mavoori
    Journal of Electronic Materials, 2001, 30 : 1190 - 1196
  • [6] Constitutive relations on creep for SnAgCuRE lead-free solder joints
    Zhigang Chen
    Yaowu Shi
    Zhidong Xia
    Journal of Electronic Materials, 2004, 33 : 964 - 971
  • [7] Constitutive relations on creep for SnAgCuRE lead-free solder joints
    Chen, ZG
    Shi, YW
    Xia, ZD
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (09) : 964 - 971
  • [8] Creep Behavior of Bi-Containing Lead-Free Solder Alloys
    Witkin, David
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (02) : 190 - 203
  • [9] Creep resistance of tin-based lead-free solder alloys
    Huang, ML
    Wu, CML
    Wang, L
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (11) : 1373 - 1377
  • [10] Creep Behavior of Bi-Containing Lead-Free Solder Alloys
    David Witkin
    Journal of Electronic Materials, 2012, 41 : 190 - 203
12345