Innovative synthesis of CeO2 nanoparticles for advanced chemical mechanical polishing

被引：0
|
作者：
Ren, Gaoyuan [1 ]
Wang, Li [1 ,2 ]
Wang, Shudong [1 ]
机构：
[1] Chinese Acad Sci, Dalian Inst Chem Phys, Dalian Natl Lab Clean Energy, Dalian 116023, Peoples R China
[2] Univ Chinese Acad Sci, Beijing 100049, Peoples R China
来源：
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS | 2025年 / 705卷
关键词：
CeO2; High crystallinity; CMP; SiO; 2; film; CERIUM OXIDE; OXYGEN; MORPHOLOGY; CATALYSTS; ABRASIVES; PLANARIZATION; TEMPERATURE; NANORODS; SLURRY;
D O I：
10.1016/j.colsurfa.2024.135764
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
This study presents a novel chemical precipitation method for synthesizing cerium dioxide (CeO2) nanoparticles with superior chemical mechanical polishing (CMP) performance. Cerium nitrate and ammonia were used as the cerium source and precipitant, respectively, in a nitrogen atmosphere. The hypothesis that higher oxygen vacancy density and redox capability would enhance the material removal rate (MRR) was tested. The synthesized CeO2 nanoparticles exhibited improved crystallinity and oxygen exchange properties, as confirmed by XPS and H2-TPR analysis. The results showed that CeO2 synthesized at 0.7 M cerium nitrate after 24 hours outperformed commercial CeO2 with an MRR of 3095.53 & Aring;/min, attributed to the high concentration of Ce3+ ions and oxygen vacancies. This study provides new insights into the role of oxygen exchange and vacancy density in optimizing CeO2-based abrasives for CMP applications.
引用
收藏
页数：11
相关论文
共 50 条
  • [1] Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing
    Wang, Zhenyang
    Wang, Tongqing
    Zhang, Lifei
    Lu, Xinchun
    ELECTRONIC MATERIALS LETTERS, 2023, 19 (06) : 580 - 587
  • [2] Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing
    Zhenyang Wang
    Tongqing Wang
    Lifei Zhang
    Xinchun Lu
    Electronic Materials Letters, 2023, 19 : 580 - 587
  • [3] Preparation of CeO2 nanoparticles and their chemical mechanical polishing as abrasives
    Li, Xia-Zhang
    Chen, Yang
    Chen, Zhi-Gang
    Chen, Jian-Qing
    Ni, Chao-Ying
    Mocaxue Xuebao/Tribology, 2007, 27 (01): : 1 - 5
  • [4] Preparation of CeO2 particles via ionothermal synthesis and its application to chemical mechanical polishing
    Chen, Chuandong
    Zhao, Siyuan
    Li, Xiaopei
    Tan, Taixing
    Liao, Wuping
    You, Hongpeng
    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2024, 694
  • [5] Improving the Dispersion Stability and Chemical Mechanical Polishing Performance of CeO2 Slurries
    Ye, Wang
    Zhang, Baoguo
    Wu, Pengfei
    Min, Liu
    Cui, Dexing
    Xian, Wenhao
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2023, 12 (04)
  • [6] Preparation of CeO2 Polishing Powder and Its Performance and Mechanism for Chemical Mechanical Polishing of Optical Glass
    Zhang, Wei
    Zhang, Peiwei
    Wu, Yuan
    Li, Xin
    Wang, Xu
    Wang, Mitang
    Jin, Siqingaowa
    Bi, Wei
    Zhao, Yan
    Zhou, Wei
    Zhang, Dongliang
    ACS APPLIED MATERIALS & INTERFACES, 2025, 17 (13) : 20394 - 20410
  • [7] Polymethylmethacrylate (PMMA)/CeO2 hybrid particles for enhanced chemical mechanical polishing performance
    Chen, Yang
    Li, Zhina
    Miao, Naiming
    TRIBOLOGY INTERNATIONAL, 2015, 82 : 211 - 217
  • [8] Synthesis of a Flaky CeO2 with Nanocrystals Used for Polishing
    Zhang, Yiming
    Gou, Li
    MATERIALS, 2024, 17 (12)
  • [9] Solvothermal synthesis of CeO2 nanoparticles
    Zhang, Yong Cai
    Zhang, En Ren
    APPLICATION OF CHEMICAL ENGINEERING, PTS 1-3, 2011, 236-238 : 2000 - 2003
  • [10] Effect of Nano-sized CeO2 Abrasives on Chemical Mechanical Polishing of Silicon Wafer
    ZHANG Bao-sen 1
    2. Department of Materials Engineering
    Semiconductor Photonics and Technology, 2006, (02) : 81 - 84
12345