Polygonal manifold element for thin plate-bending analysis
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作者:
Wen, Wei-Bin
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机构:
School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, ChinaSchool of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China
Wen, Wei-Bin
[1
]
Luo, Shao-Ming
论文数: 0引用数: 0
h-index: 0
机构:
School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, ChinaSchool of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China
Luo, Shao-Ming
[1
]
机构:
[1] School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China