Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5%Ag solders

被引：49
|
作者：
Shen, Jun [1 ]
Liu, Yong-Chang [1 ]
Han, Ya-Jing [1 ]
Gao, Hou-Xiu [1 ]
Wei, Chen [1 ]
Yang, Yu-Qin [1 ]
机构：
[1] College of Materials Science and Engineering, Tianjin University, Tianjin 300072, China
来源：
Transactions of Nonferrous Metals Society of China (English Edition) | 2006年 / 16卷 / 01期
关键词：
D O I：
10.1016/S1003-6326(06)60011-3
中图分类号：
学科分类号：
摘要：
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页码：59 / 64
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