Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs

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作者：
RTI International, Research Triangle Park, NC, United States [1 ]
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不详 [3 ]
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来源：
Proc Electron Compon Technol Conf | 2011年 / 1815-1821期
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Compilation and indexing terms; Copyright 2025 Elsevier Inc;
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摘要：
Grain size and shape - Reliability - Ion beams - Three dimensional integrated circuits - Electronics packaging - Failure (mechanical) - Silicon wafers - Copper
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