Numerical simulation approach on stress and strain for chip scale package under thermal cycling

被引：0
|
作者：
Ping, Yang [1 ]
Li, Wei [1 ]
机构：
[1] Laboratory of Advanced Design, Manufacturing and Reliability, for MEMS/NEMS, Jiangsu University, Zhenjiang, 212013, China
来源：
International Journal of Manufacturing Technology and Management | 2009年 / 18卷 / 03期
关键词：
D O I：
10.1504/IJMTM.2009.026386
中图分类号：
学科分类号：
摘要：
5
引用
收藏
页码：300 / 307
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