Physical properties of experimental light-curing pattern resins based on poly (n-butyl methacrylate) or poly(iso-butyl methacrylate)

Experimental light-curing pattern resins were fabricated to produce pattern resin materials with adequate dimensional stability. The light-curing pattern resins consisted of poly(n-butyl methacrylate) or poly(iso-butyl methacrylate) (PiBMA) polymers and methacrylate monomers. The physical properties, amount of residual ash after burning, Vickers hardness, flexural strength, and volumetric polymerization shrinkage of each material were determined. The data obtained for the prepared resins were compared with those of a commercially available pattern resin, Palavit G (PG). A lower amount of residual ash was observed for some of the prepared resins than for PG. The Vickers hardness and flexural strength values of all experimental resins were lower than those of PG. The volumetric polymerization shrinkage of all the experimental resins based on PiBMA was lower than that of PG. These results suggest that acrylic light-curing resin materials based on PiBMA may be useful for patterning and indexing during soldering.