Design and experiment on SEM based nanometric cutting device

To solve the problem that online high-resolution observation failed to be realized in cutting process with the current nanometric cutting mechanism, a nanometric cutting device under high vacuum condition based on SEM was designed and established. Motion accuracy analysis of the device was carried out and nanometric cutting of typical single crystal materials with online observation was researched. The proposed device can realize displacement output in the range of 7 μm with closed-loop resolution of 0.6, nm in both cutting direction and depth direction. The motion accuracy of the device was measured by white light interferometer. Step structures with different cutting depths were machined and the height differences between the steps were 59.3 nm, 115.1 nm and 161.2 nm, respectively. Nanometric cutting experiment was carried out on single-crystal copper and silicon by using diamond tool with straight edge. The experimental result indicates that the developed nanometric cutting device enables nanoscale material removal behavior to be achieved with online high-resolution observation. ©, 2015, Tianjin University. All right reserved.