Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package

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[1] [1,Cui, Hui-Wang
[2] Fan, Qiong
[3] 1,Li, Dong-Sheng
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Cui, H.-W. (cuihuiwang@hotmail.com) | 1600年 / Elsevier Ltd卷 / 48期
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