Effects of hygrothermal aging on anisotropic conductive adhesive joints: Experiments and theoretical analysis

被引：0

作者：

Lin, Y.C. ^{[1
,2
]}

Chen, X. ^{[1
]}

Wang, Z.P. ^{[3
]}

机构：

[1] School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China

[2] School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China

[3] China Technology Center, Philips Mobile Display Systems, Shanghai 200131, China

来源：

Journal of Adhesion Science and Technology | 2006年 / 20卷 / 12期

关键词：

Epoxy-based anisotropic conductive adhesive film (ACF) joints have been used in a number of interconnect applications; including direct chip attachment; i.e; chip on glass; chip on ceramics; etc. The ACF joints can be subjected to high relative humidity environment and are susceptible to moisture sorption; especially at elevated temperatures. The long-term hygrothermal aging will induce irreversible changes to epoxy resin systems due to susceptibility of the polymer resin to hydrolysis; oxidation; etc. In this study; the hygrothermal environment was used as an accelerator for the degradation of ACF joints in chip-on-glass (COG) assemblies; which were fabricated in the form of single-lap joints. The effects of aging on the epoxy-based ACF joints were characterized by shear tests and scanning electron microscopy (SEM) at accelerated aging times of 125; 250; 375 and 550 h. The results show that the strength of ACF joints decreases and the fracture mechanism gradually changes with hygrothermal aging. In order to further interpret the hygrothermally-induced degradation to the ACF joints; an ACF joint aging model with hygrothermal environment has been developed; introducing a dimensionless parameter A; which was obtained from the interfacial fracture energy. © VSP 2006;

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摘要：

Journal article (JA)

引用

页码：1383 / 1399

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