Hot Deformation Behaviour and Microstructural Evolution of Ni-Mo Superalloy

被引:0
|
作者
Luo, Rui [1 ,4 ]
Sheng, Donghua [1 ,2 ]
Wang, Zixing [2 ]
Gao, Pei [3 ]
Chen, Leli [1 ]
Xu, Haoxiang [2 ]
Cao, Fuyang [1 ]
机构
[1] Jiangsu Univ, Sch Mat Sci & Engn, Zhenjiang 212013, Peoples R China
[2] Jiangsu Ind Technol Res Inst, Inst Novel Met & Appl Technol, Changshu 215506, Peoples R China
[3] Jiangsu Yinhuan Precis Steel Pipe Co Ltd, Yixing 214203, Peoples R China
[4] Chongqing Univ, State Key Lab Mech Transmiss Adv Equipment, Chongqing 400044, Peoples R China
关键词
Hastelloy B3; dynamic recrystallization; constitutive model; critical strain; recrystallisation kinetics; DYNAMIC RECRYSTALLIZATION; ALLOY; MECHANISM; MODEL;
D O I
10.12442/j.issn.1002-185X.20230537
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The hot deformation behaviour and microstructural evolution of a kind of Ni-Mo alloy (Hastelloy B3) were investigated by Gleeble-3500 thermal simulation tester in the temperature range of 950-1250 degrees C, and in the strain rate range of 0.01-5 s(-1). Electron backscatter diffraction (EBSD) was used to analyze the microstructure evolution. Arrhenius constitutive model of this alloy was developed on the basis of peak stresses. The microstructural evolution of Hastelloy B3 alloy during deformation was observed via an optical microscope. The critical strain of dynamic recrystallization (DRX) of Hastelloy B3 was identified based on the work hardening rate versus flow stress curves. The DRX kinetics for Hastelloy B3 alloy can be represented in the form of Avrami equation. The results show that DRX behaviour tends to occur at high temperatures and low strain rates of deformation parameters. According to the EBSD analysis of the grain boundary angle and dislocation density of the deformed organisation of the alloy, dislocations tend to accumulate at the original grain boundaries to form low-angle grain boundaries and then evolve into high-angle grain boundaries. Thus, the main DRX mechanism for Hastelloy B3 alloy is identified to be discontinuous dynamic recrystallisation (DDRX) with continuous dynamic recrystallisation (CDRX) as a supplement.
引用
收藏
页码:3111 / 3120
页数:10
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