Screen Printing Conductive Ink Transfer Mechanism and Simulation Research

被引:0
|
作者
Liu S. [1 ,2 ,3 ]
Li Y. [1 ,2 ,3 ]
Tian Y. [1 ,2 ,3 ]
Yuan Y. [1 ,2 ]
机构
[1] Beijing Key Laboratory of Digitization Printing Equipment, Beijing Institute of Printing, Beijing
[2] Research Center of Printing Equipment of Beijing Universities, Beijing Institute of Printing, Beijing
[3] Beijing Engineering Research Center of Printed Electronics, Beijing
关键词
Conductive ink; Drop volume; Dynamic pressure in wedge region; Screen printing; Transfer mechanism;
D O I
10.3901/JME.2021.05.231
中图分类号
学科分类号
摘要
In order to clearly and intuitively understand the mechanism of the ink filling mechanism and the screen rebound mechanism. According to the screen-printing ink transfer process, the theoretical analysis model is established. The fluid dynamics is used to analyze the function relationship between the ink outlet speed and pressure change during the ink filling process. The elastohydrodynamic lubrication is used to analyze the influence change between the dynamic pressure of the wedge zone and the rebound force generated by the ink; and Fluent is used to verify the analysis results. The theoretical results show that when the dynamic pressure in the wedge area is 8×105Pa, the resilience of conductive ink at both ends of the mesh is significantly greater than that at the middle position, and the resilience at the position of 20- 30 μm does not change basically. The simulation results show that when scraping with the increase of knife speed, the ink outlet speed increases, but the pressure change shows a decreasing trend. This proves that the scraper speed of screen printing cannot be too large or too small, and there is an optimal speed range, about 40-65 m/s. Under different dynamic pressure of wedge area, the two ends of ink resilience at the mesh are greater than the middle position, and there is no change in the position of 20-30 μm. The maximum ink drop on the substrate occurs in the wedge area, and the dynamic pressure is 7×105-9×105 Pa, it accounts for 95.6% of the mesh volume, which is about 0.189 3 mm3. In order to ensure enough ink drop on the substrate, the dynamic pressure of wedge area can be increased to improve the printing quality. © 2021 Journal of Mechanical Engineering.
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页码:231 / 241
页数:10
相关论文
共 19 条
  • [1] FENG Linrun, TANG Wei, GUO Xiaojun, Development status, opportunities and challenges of organic thin film transistors, Science & Technology Review, 35, 17, pp. 37-45, (2017)
  • [2] ZHAO Dongbai, Screen printing process, (2012)
  • [3] LI Luhai, XIN Zhiqing, LI Xiu, Et al., Research progress on conductive ink printing transfer rate and its influencing factors, Science Herald, 35, 11, pp. 46-52, (2017)
  • [4] YE Yicheng, Analysis and research of screen printing process parameters, (2007)
  • [5] RIEMER D E., The direct emulsion screen as tool for high resolution thick film printing, Electronic Components Conference Proceedings, pp. 463-467, (1971)
  • [6] RIEMER D E., Anslytical engineering model of the screen printing process, Soild State Technol, 1, 1, pp. 40-56, (1988)
  • [7] RIEMER D E., The theoretical fundamentals of the screen printing process, Hybrid Circuits, 1, 18, pp. 8-17, (1989)
  • [8] WHITMORE R L., The viscous flow of disperse suspensions in tubes, in rheology of disperse systems' published by British society of rheology, (1959)
  • [9] NIKIL, Predicting the behavior of screen printing, Packing and Manufacturing Technology, 3, 3, pp. 508-515, (2013)
  • [10] LI Junfeng, Research on screen printing ink transfer model and parameter optimization, (2013)