Effect of binders on the performance of copper sintering pastes

被引：0
|
作者：
Saccon, Rodolfo [1 ]
Benin, Alice [1 ]
Bhogaraju, Sri Krishna [1 ]
Elger, Gordon [1 ]
机构：
[1] Institute of Innovative Mobility (IIMo), Technische Hochschule Ingolstadt, Ingolstadt,85049, Germany
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Boiling point - Copper oxides - Electronics packaging - Sintering
引用
收藏
页码：71 / 72
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