Optimized bimodal silver particle sintering for high thermal conductivity die-attach layers

被引：0
|
作者：
Du, Rongbao [1 ,2 ]
Zou, Guisheng [1 ,2 ]
Du, Chengjie [1 ,2 ]
Wang, Shuaiqi [1 ,2 ]
Liu, Lei [1 ,2 ]
机构：
[1] Tsinghua Univ, Dept Mech Engn, State Key Lab Clean & Efficient Turbomachinery Pow, Beijing 100084, Peoples R China
[2] Minist Educ, Key Lab Adv Mat Proc Technol, Beijing 100084, Peoples R China
来源：
MATERIALS LETTERS | 2024年 / 377卷
基金：
中国国家自然科学基金; 北京市自然科学基金;
关键词：
Die attach; Effective thermal conductivity; Bimodal-silver film; Sintered silver;
D O I：
10.1016/j.matlet.2024.137467
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A bimodal silver system can achieve higher effective thermal conductivity (ETC) than a mono-system for electronic packaging. However, the effect of micron- and submicron-particle compositions on the microstructure and ETC of sintered Ag is unclear. In this study, Ag films with varying particle compositions were fabricated by pulsed laser deposition. The results indicate that the sintered bimodal Ag film with 76 vol% submicron-particles possesses the highest ETC (260 W m- 1 K-1). This enhancement is attributed to the decreased porosity, increased pore circularity and pore distribution uniformity. This particle composition modulation strategy can provide a guideline for developing high-performance die-attach materials for electronic packaging.
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页数：4
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