Effect of Etching Gas on Adhesion between Mold Resin and Sputtered Stainless Steel Ground Films in Electromagnetic Shield Packages

被引：0

作者：

Homma, Soichi ^{[1
,4
]}

Okada, Daichi ^{[2
]}

Sawanobori, Akihito ^{[1
]}

Yamamoto, Susumu ^{[1
]}

Imoto, Takashi ^{[3
]}

Nishikawa, Hiroshi ^{[5
]}

机构：

[1] Kioxia Corporation, Memory Packaging Development Department, 800 Yamanoisshiki-cho, Yokkaichi, Mie,512-8550, Japan

[2] Kioxia Corporation, Memory Packaging Engineering Department, 800 Yamanoisshiki-cho, Yokkaichi, Mie,512-8550, Japan

[3] Kioxia Corporation, Memory Packaging Development Department, 2-5-1 Kasama, Sakae-ku, Kanagawa, Yokohama,247-8585, Japan

[4] Osaka University, Graduate School of Engineering, 2-1 Yamadaoka, Osaka, Suita,565-0871, Japan

[5] Osaka University, Joining and Welding Research Institute, 11-1 Mihogaoka, Osaka, Ibaraki,567-0047, Japan

来源：

2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Adhesion - Brazing - Copper - Electromagnetic pulse - Electromagnetic shielding - Electronics packaging - Etching - Fillers - Integrated circuit interconnects - Molds - Silica - Silicon - Silicon alloys - Silicon oxides - Stability criteria - Stainless steel

引用

页码：113 / 114

共 5 条

[1] Adhesion Mechanism between Mold Resin and Sputtered Stainless Steel Ground Films for Electromagnetic Wave Shield Packages
Homma, Soichi
Takano, Yuusuke
Watanabe, Takeshi
Murakami, Kazuhiro
Fukuda, Masatoshi
Imoto, Takashi
Nishikawa, Hiroshi
MATERIALS TRANSACTIONS, 2022, 63 (06) : 766 - 775
[2] Adhesion mechanism between mold resin and sputtered copper for electromagnetic wave shield packages
Homma, Soichi
Shima, Masaya
Takano, Yuusuke
Watanabe, Takeshi
Murakami, Kazuhiro
Fukuda, Masatoshi
Imoto, Takashi
Nishikawa, Hiroshi
THIN SOLID FILMS, 2022, 750
[3] Quantification of Adhesion Strength and Mechanism of Adhesion Degradation between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages
Homma, Soichi
Okada, Daichi
Sawanobori, Akihito
Yamamoto, Susumu
Nishikawa, Hiroshi
2024 IEEE 10TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC 2024, 2024,
[4] Effect of Ar and N2 plasma etching on adhesion between mold resin and sputtered Cu in semiconductor electromagnetic shielding
Homma, Soichi
Shima, Masaya
Takano, Yuusuke
Watanabe, Takeshi
Fukuda, Masatoshi
Imoto, Takashi
Nishikawa, Hiroshi
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2024, 38 (06) : 815 - 838
[5] ADHESION STUDIES OF RADIOFREQUENCY SPUTTERED SIO2-FILMS ON TI, STAINLESS-STEEL, NI AND INCONEL SUBSTRATES - EFFECTS OF SUBSTRATE SURFACE ION-BOMBARDMENT ETCHING
LEE, GH
CAILLER, M
CONSTANTINESCU, C
KWON, SC
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1990, 4 (06) : 481 - 501

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