Self-Healing Interconnects for Hybrid Flexible Electronics

被引：0
|
作者：
Ranjan, Piyush [1 ]
Ding, Li [2 ]
Trivedi, Kruti [3 ]
Parab, Virendra [1 ]
Nair, Manju S. [1 ,4 ]
Joshi, Pushkaraj [5 ,6 ]
Sambandan, Sanjiv [5 ,7 ]
机构：
[1] Department of Instrumentation and Applied Physics, Indian Institute of Science, Bengaluru,560012, India
[2] The Department of Engineering, University of Cambridge, Cambridge,CB30FF, United Kingdom
[3] Department of Electronic Systems Engineering, Indian Institute of Science, Bangalore,560012, India
[4] Liquid Propulsion Systems Centre, Indian Space Research Organization, Trivandrum,695547, India
[5] Department of Engineering, University of Cambridge, Cambridge,CB30FF, United Kingdom
[6] The Post-Doctoral Research, Brown University, Providence,RI,02912, United States
[7] Department of Instrumentation and Applied Physics, Department of Electronic Systems Design, Indian Institute of Science, Bengaluru,560012, India
来源：
IEEE Journal on Flexible Electronics | 2022年 / 1卷 / 02期
关键词：
This work was supported in part by the Department of Science and Technology (DST) Impacting Research Innovation and Technology (IMPRINT) under Grant 7969; in part by the Engineering and Physical Sciences Research Council (EPSRC) under Grant RG92121; and in part by the Science and Engineering Research Board (SERB) Core Research Grant (CRG) under Grant CRG/2021/006005;
D O I：
10.1109/JFLEX.2022.3168623
中图分类号：
学科分类号：
摘要：
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页码：98 / 106
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