Balancing Interfacial Toughness and Intrinsic Dissipation for High Adhesion and Thermal Conductivity of Polymer-Based Thermal Interface Materials

被引：0
|
作者：
Sheng, Jiashuo [1 ,2 ]
Zhang, Zhian [1 ]
Pang, Yunsong [1 ]
Cheng, Xiaxia [1 ]
Zeng, Chen [1 ]
Xu, Jian-Bin [3 ]
Zhang, Leicong [1 ]
Zeng, Xiaoliang [1 ]
Ren, Linlin [1 ]
Sun, Rong [1 ]
机构：
[1] National Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen,518055, China
[2] Nano Science and Technology Institute, University of Science and Technology of China, Suzhou,215123, China
[3] Department of Electronics Engineering, The Chinese University of Hong Kong, N.T., Shatin,999077, Hong Kong
来源：
ACS Applied Materials and Interfaces | 2024年 / 16卷 / 45期
基金：
中国国家自然科学基金;
关键词：
Bioreactors - Computer resource management - Corrosion prevention - Electrochemical corrosion;
D O I：
10.1021/acsami.4c13118
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：62961 / 62969
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