共 14 条
- [1] WU Junying, YANG Lijun, WU Bao, Et al., Experiment and numerical simulation of ablation on aluminum target with high-intensity laser, Transactions of Beijing Institute of Technology, 38, 10, pp. 1018-1024, (2018)
- [2] WU Junying, ZHANG Xiaozhou, LIU Jiaxi, Et al., Impact pressure numerical simulation of femtosecond laser ablation of explosives, Transactions of Beijing Institute of Technology, 40, 10, pp. 21-27, (2020)
- [3] CAI Hailong, YAN Xueliang, WANG Sumei, Et al., Advances in femtosecond laser fabrication of microchannels, Transactions of Beijing Institute of Technology, 32, 10, pp. 991-1003, (2012)
- [4] LU Xizhao, JIANG Kaiyong, Research and application development of compound energy field processing-laser microjet, Scientia Sinica Physica, Mechanica & Astronomica, 50, 3, pp. 30-43, (2020)
- [5] FENG Shaochuan, HUANG Chuanzhen, WANG Jun, Et al., Surface quality evaluation of single crystal 4H-SiC wafer machined by hybrid laser-waterjet: comparing with laser machining, Materials Science in Semiconductor Processing, 93, pp. 238-251, (2019)
- [6] KENNEDY P K, HAMMER D X, ROCKWELL B A., Laser-induced breakdown in aqueous media, Progress in Quantum Electronics, 21, 3, pp. 155-248, (1997)
- [7] SPIEGEL A, VAGO N, WAGNER F R., High efficiency raman scattering in micrometer-sized water jets, Optical Engineering, 43, 2, pp. 450-455, (2004)
- [8] PORTER J A, LOUHISALMI Y A, KARJALAINEN J A, Et al., Cutting thin sheet metal with a water jet guided laser using various cutting distances, feed speeds and angles of incidence, The International Journal of Advanced Manufacturing Technology, 33, 9-10, pp. 961-967, (2007)
- [9] GOBET M, OBI S, PAVIUS M, Et al., Implementation of short pulse lasers for wafer scribing and grooving applications, Journal of Laser Micro/ Nanoengineering, 5, pp. 16-20, (2010)
- [10] GUO Z, KUMAR S., Three-dimensional discrete ordinates method in transient radiative transfer, Journal of Thermophysics and Heat Transfer, 16, 3, pp. 289-296, (2002)