Mechanism and Quality Analysis of Laser Assisted Grinding of Silicon Nitride Ceramics Influenced by Regular Patterns

被引:0
|
作者
Zheng D. [1 ]
Qian W. [1 ]
Wu C. [2 ]
Guo W. [1 ]
机构
[1] School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai
[2] College of Mechanical Engineering, Donghua University, Shanghai
关键词
grinding force; grinding mechanism; laser induced micro-groove; silicon nitride; surface roughness;
D O I
10.3901/JME.2022.15.152
中图分类号
学科分类号
摘要
In order to solve the problem of difficult machining of silicon nitride ceramics, the laser induced micro-groove assisted grinding is studied. According to the mechanism of laser-assisted grinding, an experimental system of laser-assisted grinding is built, and three kinds of regular pattern surface microstructures, such as ring, checkerboard and arc, are designed. Through the grinding mechanics and geometry analysis of the influence of three kinds of regular patterns micro-grooves, and then combined with the grinding process cutter design, the grinding force and surface roughness of silicon nitride ceramics are measured. The results show that the laser induced micro-groove assisted grinding can reduce the grinding force and surface roughness of engineering ceramics, so as to improve the grinding efficiency and quality of engineering ceramics. The grinding force of the surface with laser induced micro-texture at 40 μm grinding depth is similar to that of the surface without laser assisted grinding at 10 μm grinding depth, and the machining quality can be improved up to 6%. Meanwhile, comparison of grinding force and machining quality shows that the ring regular pattern is the best laser induced micro-groove trajectory. © 2022 Editorial Office of Chinese Journal of Mechanical Engineering. All rights reserved.
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页码:152 / 165
页数:13
相关论文
共 31 条
  • [1] WANG Tao, WANG Sheng, QIAO Weilin, Et al., Research on grinding force model of plane grinding for unidirectional C/SiC composites, China Mechanical Engineering, 30, 17, pp. 2017-2021, (2019)
  • [2] YAO Yansheng, YUAN Zhuzhu, WANG Yuanyuan, Et al., Research on ultrasonic-laser machining underwater and its mechanism for silicon nitride ceramics [J], Journal of Mechanical Engineering, 53, 27, pp. 207-216, (2017)
  • [3] CHEN J, HUANG H, XU X., An experimental study on the grinding of alumina with a monolayer brazed diamond wheel[J], The International Journal of Advanced Manufacturing Technology, 41, 1-2, pp. 16-23, (2009)
  • [4] WANG Xiangwei, WANG Hailong, WANG Yang, Technology of cutting ceramic sheetswith microwave based on thermal controlled fracture method[J], China Mechanical Engineering, 30, 23, pp. 2820-2828, (2019)
  • [5] CAO Jianguo, ZHANG Qinjian, Material removal behavior in ultrasonic assisted grinding of SiC ceramics[J], Journal of Mechanical Engineering, 55, 13, pp. 205-211, (2019)
  • [6] CAO J, WU Y, LU D, Et al., Material removal behavior in ultrasonic-assisted scratching of SiC ceramics with a single diamond tool[J], International Journal of Machine Tools and Manufacture, 79, pp. 49-61, (2014)
  • [7] ZHANG X, CHEN G, AN W, Et al., Experimentalinvestigations of machining chara-cteristics of laser-induced thermal cracking in alumina ceramic wet grinding[J], The International Journal of Advanced Manufacturing Technology, 72, 9-12, pp. 1325-1331, (2014)
  • [8] LIU Wei, DENG Zhaohui, WAN Linlin, Et al., Simulation and experiment study for silicon nitride cutting with single diamond grain [J], Journal of Mechanical Engineering, 51, 21, pp. 191-198, (2015)
  • [9] DENG Jiayun, PAN Jisheng, ZHANG Qixiang, Et al., Research progress in chemical mechanical polishing of single crystal SiC substrates[J], Diamond & Abrasives Engineering, 40, 1, pp. 79-91, (2020)
  • [10] JIA Xiaofeng, ZHAO Bo, Design and application of large load amplitude transformer in ELID compound internal grinding system assisted by ultrasonic vibration [J], Diamond & Abrasives Engineering, 40, 1, pp. 15-23, (2020)