Micro-sized SnAg solder bumping technology and bonding reliability

被引：0
|
作者：
Lin, Xiaoqin [1 ,2 ]
Zhu, Dapeng [1 ,2 ]
Luo, Le [1 ]
机构：
[1] Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
[2] Graduate University, Chinese Academy of Sciences, Beijing 100049, China
来源：
Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors | 2008年 / 29卷 / 01期
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页码：168 / 173
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