共 50 条
- [1] Three-dimensional shock spectra of a cubic nonlinear packaging system with critical component Zhendong yu Chongji/Journal of Vibration and Shock, 2010, 29 (07): : 92 - 93
- [3] 3-dimensional shock response spectra characterizing shock response of a tangent packaging system with critical components Zhendong yu Chongji/Journal of Vibration and Shock, 2008, 27 (01): : 167 - 168
- [4] Effect of thermal shock on Cu extrusion of TSV for three-dimensional packaging KOREAN JOURNAL OF METALS AND MATERIALS, 2014, 52 (06): : 459 - 465
- [5] Damage boundary surface of a tangent nonlinear packaging system with critical component Zhendong yu Chongji/Journal of Vibration and Shock, 2008, 27 (02): : 166 - 167
- [7] Shock response of a nonlinear tangent packaging system with rotation Zhendong yu Chongji/Journal of Vibration and Shock, 2010, 29 (10): : 131 - 136
- [8] Factors influencing shock characteristics of a cubic nonlinear packaging system with critical component Zhendong yu Chongji/Journal of Vibration and Shock, 2010, 29 (10): : 179 - 181
- [9] Three-dimensional analysis of an enhanced cooling system for electronic packaging PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 431 - 437
- [10] MSLP solution to dropping shock of tangent nonlinear packaging system Zhendong yu Chongji/Journal of Vibration and Shock, 2022, 41 (11): : 266 - 270