Electroless Ni/Pd/Au plating for semiconductor package substrates II ?Effect of Au plating under-layer structure on Au wire bonding strength

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作者：
机构：
[1] Ejiri, Yoshinori
[2] Sakurai, Takehisa
[3] Arayama, Yoshinori
[4] Suzuki, Kuniji
[5] Tsubomatsu, Yoshiaki
[6] Akai, Kunihiko
[7] Nakagawa, Masashi
[8] Yamamura, Taizou
[9] Hiroyama, Yukihisa
[10] Hasegawa, Kiyoshi
来源：
Ejiri, Yoshinori | 1600年 / Japan Institute of Electronics Packaging卷 / 17期
关键词：
Compendex;
D O I：
10.5104/jiep.17.297
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