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Tin, lead, and tin-lead plating
被引:0
|作者:
Hirsch, Stanley
[1
]
Rosenstein, Charles
[2
]
机构:
[1] Leeam Consultants Ltd., New Rochelle, NY
[2] ShellCase Ltd., Jerusalem, Israel
关键词:
Organic additives - Plating baths - Solderability - Tin-lead alloys;
D O I:
10.1016/S0026-0576(02)82033-5
中图分类号:
学科分类号:
摘要:
(Edited Abstract)
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页码:291 / 306
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