Recoverability degradation of adhesion between soft matters under uniaxial cyclic bonding-debonding: Modified cohesive interface model and numerical implementation

被引:0
|
作者
Hu, L. B. [1 ]
Cong, Y. [2 ]
Xia, Z. X. [2 ]
Gu, S. T. [3 ]
Feng, Z. -Q. [2 ,4 ]
机构
[1] Southwest Univ, Coll Engn & Technol, Chongqing 400715, Peoples R China
[2] Univ Evry, Univ Paris Saclay, LMEE, F-91020 Evry, France
[3] Chongqing Univ, Sch Civil Engn, Chongqing 400044, Peoples R China
[4] Southwest Jiaotong Univ, Sch Mech & Aerosp Engn, Chengdu 611756, Peoples R China
关键词
Recoverable adhesion degradation; Modified cohesive interface model; Bi-potential contact algorithm; Hyperelastic materials; ZONE MODEL; PROPAGATION; STRENGTH; FRICTION;
D O I
10.1016/j.engfracmech.2024.110444
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
The main objective of this work is to propose a partial recoverable cohesive interface model, coupled with a bi-potential contact algorithm, to simulate the phenomenon of adhesion recoverability degradation under cyclic bonding-debonding between hyperelastic bodies. For this end, the proposed adhesion recoverability degradation model is constructed by defining the recovery of interface damage during the rebonding when two bodies come into contact, and a degradation factor related to the number of bonding-debonding cycles is introduced into the fully recoverable adhesion model to reduce energy dissipation after multiple cycles. Recoverability degradation includes adhesive stiffness and strength degradation, which is physically described as parallel, series and mixed arrays of adhesive bonds. Then, a finite element framework coupling the adhesion recoverability degradation model and the bi-potential contact algorithm is proposed, with Mooney-Rivlin hyperelastic material used to describe the soft matters. This framework is implemented in an in-house finite element code, with numerical examples demonstrating the model's reliability. The proposed approach could be applied to investigate interfacial adhesion effects in fields such as flexible electronics and intelligent robotics.
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页数:18
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