In-circuit pin testing: An excellent potential source of value creation

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作者
Holtzer, Mitch
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SMT Surface Mount Technology Magazine | 2015年 / 30卷 / 06期
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In-circuit pin testing (ICT) is a common method of inspecting electronic assemblies to measure the effectiveness of the assembly process and to predict electrical functionality. Test probes are put in contact with dedicated test points along the surface of an assembly, checking for electrical functions such as resistance, capacitance inductance and signal timing. The two basic types of ICT are commonly referred to as clamshell and flying probe. The clamshell ICT simultaneously tests dozens of points on a single board. One laboratory type of clamshell ICT device uses three types of pins and four different forces. Flying probe testing is also commonly used for lower value or lower volume assemblies. Flying probes test sequences are determined by easily changeable programming inputs.
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页码:68 / 71
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