Creep deformation and fracture mechanisms of DD3 at elevated temperatures

Creep behavior of [001], [011] and [111] orientated DD3 at elevated temperatures was investigated. It was showed that there are different number of movable slip systems for different orientation, each adds up to the substantially same deformation amount at the last stage of creep. At 950°C or higher, specimens were fractured along the plane related to the dendritic crystal direction for different orientations since diffusion mechanism dominant the deterioration of the material due to creep deformation; at 750°C, however, the specimens were fractured along the some slip planes due to slip mechanism.