Creep-controlled diffusional hillock formation in blanket aluminum thin films as a mechanism of stress relaxation

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[1] Kim, Deok-Kee
[2] Nix, William D.
[3] Deal, Michael D.
[4] Plummer, James D.
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Kim, D.-K. | 1709年 / Materials Research Society卷 / 15期
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Thanks are due to Dr. Hoojeong Lee for nanoprobe EDS measurements; Dongwon Park for the help in taking TEM pictures; and Erica Lilleodden and Ranjana Saha for nanoindentation measurements. This work was funded by Sematech; Semiconductor Industry Association (SIA); and Defense Advanced Research Projects Agency (DARPA) under the Microelectronics Advanced Research Corporation (MARCO) Interconnect Focus Center program;
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