Modeling of localized reflow in solder/magnetic nanocomposites for area-array packaging

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[1] Xu, Siyang
[2] Pickel, Andrea D.
[3] Prasitthipayong, Anya
[4] Habib, Ashfaque H.
[5] McHenry, Michael E.
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Xu, S. (siyangx@andrew.cmu.edu) | 1600年 / American Institute of Physics Inc.卷 / 113期
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