Embedded die technology breakthrough: The redistributed chip package

被引：0
|
作者：
Keser, Beth [1 ]
Amrine, Craig [1 ]
Leal, George [1 ]
Lytle, William [1 ]
Mitchell, Doug [1 ]
Wenzel, Robert [1 ]
机构：
[1] Freescale Semiconductor Inc., 2100 East Elliot Road, Tempe, AZ 85284, United States
来源：
Journal of Japan Institute of Electronics Packaging | 2008年 / 11卷 / 04期
关键词：
All Open Access; Bronze;
D O I：
10.5104/jiep.11.280
中图分类号：
学科分类号：
摘要：
Power amplifiers
引用
收藏
页码：280 / 284
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