The impact of lead-free soldering on electronics packages

被引：10
|
作者：
Yang, L. [1 ]
Bernstein, J.B. [1 ]
Chung, K. [1 ]
机构：
[1] Intel Corporation, Sacramento, CA, United States
来源：
| 2001年 / Emerald卷 / 18期
关键词：
D O I：
10.1108/13565360110405848
中图分类号：
学科分类号：
摘要：
引用
下载
收藏
相关论文
共 50 条
  • [1] Heel crack and lead-free soldering issues affecting power electronics packages
    He, Lunwen
    Pan, Shaohui
    Wang, L. K.
    Ieee, S. M.
    Zhang, David Wei
    TENCON 2006 - 2006 IEEE REGION 10 CONFERENCE, VOLS 1-4, 2006, : 271 - +
  • [2] Advances in lead-free electronics soldering
    Suganuma, K
    CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE, 2001, 5 (01): : 55 - 64
  • [3] Lead-free reflow soldering for electronics assembly
    Harrison, MR
    Vincent, JH
    Steen, HAH
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2001, 13 (03) : 21 - 38
  • [4] Lead-free soldering in the Japanese electronics industry
    Fukuda, Y
    Pecht, MG
    Fukuda, K
    Fukuda, S
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (03): : 616 - 624
  • [5] Special issue on lead-free soldering in electronics
    Suganuma, K
    MATERIALS TRANSACTIONS, 2004, 45 (03) : 605 - 605
  • [6] Environmental issues in electronics and the transition to lead-free soldering
    Nimmo, K
    SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 371 - 377
  • [7] A review of the environmental issues in electronics and the challenge of lead-free soldering
    Nimmo, K
    ELECTRONICS GOES GREEN 2000 (PLUS): A CHALLENGE FOR THE NEXT MILLENNIUM, VOL 1, PROCEEDINGS, 2000, : 43 - 49
  • [8] Special Issue on Lead-Free Soldering in Electronics III Preface
    Suganuma, K
    MATERIALS TRANSACTIONS, 2005, 46 (11) : 2299 - 2299
  • [9] lead-free soldering
    Steffner, KJ
    KUNSTSTOFFE-PLAST EUROPE, 2005, 95 (09): : 195 - 198
  • [10] Examining the environmental impact of lead-free soldering alternatives
    Turbini, LJ
    Munie, GC
    Bernier, D
    Gamalski, J
    Bergman, DW
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2001, 24 (01): : 4 - 9
12345