Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing

被引：0
|
作者：
Yuan, Song [1 ]
Guo, Xiaoguang [1 ]
Liu, Shengtong [1 ]
Li, Penghui [1 ]
Liu, Fumin [2 ]
Zhang, Lemin [2 ]
Kang, Renke [1 ]
机构：
[1] Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian,116024, China
[2] Beijing Institute of Aerospace Control Device, Beijing,100854, China
来源：
Materials Science in Semiconductor Processing | 2022年 / 144卷
关键词：
Compendex;
D O I：
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学科分类号：
摘要：
Silicon
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