Cycle time prediction method for semiconductor wafer fabrication facility based on multi-layer data analysis framework

被引：0
|
作者：
Tang J. [1 ]
Li L. [1 ]
机构：
[1] School of Electronics and Information Engineering, Tongji University, Shanghai
来源：
Jisuanji Jicheng Zhizao Xitong/Computer Integrated Manufacturing Systems, CIMS | 2019年 / 25卷 / 05期
关键词：
Cycle time prediction; Ensemble learning; Machine learning; Multi-layer data analysis framework; Semiconductor manufacturing;
D O I：
10.13196/j.cims.2019.05.006
中图分类号：
学科分类号：
摘要：
To predict cycle time accurately of semiconductor processing based on manufacturing data and to cover the shortage of traditional model's generalization, a multi-layer data analysis framework was proposed. A cycle time prediction algorithm based on this framework was realized. Based on the data of a semiconductor line, a prediction model was built, and the effectiveness of this method was validated by comparing with several common methods. Experiments demonstrated that the proposed multi-layer data analysis framework based cycle time prediction method could effectively improve the accuracy and the generalization. © 2019, Editorial Department of CIMS. All right reserved.
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页码：1086 / 1092
页数：6
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