共 50 条
- [1] Effect of thiourea on grain refinement and defect structure of the pulsed electrodeposited nanocrystalline copper [J]. SURFACE & COATINGS TECHNOLOGY, 2013, 214 : 8 - 18
- [2] Surface Morphology and Stress in Electrodeposited Copper Nanofilms [J]. ELECTRODEPOSITION FUNDAMENTALS AND NEW MATERIALS (GENERAL) - 222ND ECS MEETING/PRIME 2012: DIETER M. KOLB MEMORIAL SYMPOSIUM, 2013, 50 (52): : 43 - 53
- [5] Influence of Grain Refinement on Direct Bonding for Electrodeposited Copper [J]. 2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019), 2019, : 216 - 219
- [8] The morphology of pulsed laser-induced damage on the surface of a copper film mirror [J]. OPTICS AND LASER TECHNOLOGY, 2003, 35 (04): : 303 - 307
- [10] Effect of over-potential on the surface morphology of electrodeposited copper micro-cylinders [J]. JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, 2007, 9 (08): : 2521 - 2523