Gallic acid as a complexing agent for copper chemical mechanical polishing slurries at neutral pH

被引：0
|
作者：
Kim, Yung Jun [1 ]
Kang, Min Cheol [2 ]
Kwon, Oh Joong [3 ]
Kim, Jae Jeong [1 ]
机构：
[1] School of Chemical and Biological Engineering, Seoul National University, Seoul 151-744, Korea, Republic of
[2] Hynix Semiconductor Inc., Advanced Process Research and Development Division, Icheon 467-701, Korea, Republic of
[3] Department of Energy and Chemical Engineering, University of Incheon, Incheon 402-749, Korea, Republic of
来源：
Japanese Journal of Applied Physics | 2011年 / 50卷 / 5 PART 1期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
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中图分类号：
学科分类号：
摘要：
Copper oxides - pH - Slurries - Amino acids - X ray photoelectron spectroscopy
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