A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors

被引：0

作者：

Wang, Xinyu ^{[1
]}

Wang, Die ^{[1
]}

Tian, Yuchen ^{[1
]}

Guo, Jing ^{[1
]}

Miao, Jinshui ^{[2
]}

Hu, Weida ^{[2
]}

Wang, Hailu ^{[2
]}

Liu, Kang ^{[1
]}

Shao, Lei ^{[3
]}

Gou, Saifei ^{[1
]}

Dong, Xiangqi ^{[1
]}

Su, Hesheng ^{[1
]}

Sheng, Chuming ^{[1
]}

Zhu, Yuxuan ^{[1
]}

Zhang, Zhejia ^{[1
]}

Zhang, Jinshu ^{[1
]}

Sun, Qicheng ^{[1
]}

Xu, Zihan ^{[4
]}

Zhou, Peng ^{[1
,5
]}

Chen, Honglei ^{[2
]}

Bao, Wenzhong ^{[1
,5
]}

机构：

[1] State Key Laboratory of Integrated Chips and Systems, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai,200433, China

[2] State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai,200083, China

[3] School of Electronic Information, Soochow University, Suzhou,215006, China

[4] Shenzhen Six Carbon Technology, Shenzhen,518055, China

[5] Shaoxin Laboratory, Shaoxing,312000, China

来源：

Chip | 2024年 / 3卷 / 04期

关键词：

52;

D O I：

10.1016/j.chip.2024.100107

中图分类号：

学科分类号：

摘要：

引用

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