Quality factor estimates of resonant beams with nonlinear vibrations

被引：0
|
作者：
Yan B. [1 ]
Liu Y. [1 ]
Dong J. [1 ]
机构：
[1] State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing
来源：
Dong, Jingxin (dongjx@tsinghua.edu.cn) | 1600年 / Tsinghua University卷 / 56期
关键词：
Nonlinear vibration; Quality factor; Resonant accelerometer; Vacuum package;
D O I：
10.16511/j.cnki.qhdxxb.2016.22.038
中图分类号：
学科分类号：
摘要：
Vacuum resonant accelerometers have nonlinear sweeping frequency response, so the regular method cannot be used to measure the quality factor. A nonlinear model of the resonant beam is used here to monitor the effect of the vacuum package. The system calculates the quality factor through fitting the sweeping frequency data for the nonlinear vibrations. Tests on a resonant accelerometer verify the consistency and accuracy of the method. The measured quality factors of the accelerometers are all above 2×105. In addition, this method is also used to measure the relationship between the pressure and the quality factor, which indicates that the pressure inside the vacuum package is about 0.1 Pa. The temperature tests and long-term monitoring tests show the reliability of the vacuum packaging. © 2016, Tsinghua University Press. All right reserved.
引用
收藏
页码：1055 / 1060
页数：5
相关论文
共 16 条
  • [1] Postma H.W.C., Kozinsky I., Husain A., Et al., Dynamic range of nanotube- and nanowire-based electromechanical systems, Applied Physics Letters, 86, 22, (2005)
  • [2] Kacem N., Hentz S., Pinto D., Et al., Nonlinear dynamics of nanomechanical beam resonators: Improving the performance of NEMS-based sensors, Nanotechnology, 20, 27, pp. 11969-11974, (2009)
  • [3] Premachandran C.S., Chong S.C., Liw S., Et al., Fabrication and testing of a wafer-level vacuum package for MEMS device, IEEE Transactions on Advanced Packaging, 32, 2, pp. 486-490, (2009)
  • [4] Hopkins R., Miola J., Setterlund R., Et al., The silicon oscillating accelerometer: A high-performance MEMS accelerometer for precision navigation and strategic guidance applications, Proceedings of the 61st Annual Meeting of the Institute of Navigation, pp. 1043-1052, (2005)
  • [5] Zou X., Thiruvenkatanathan P., Seshia A.A., A seismic-grade resonant MEMS accelerometer, Journal of Microelectro-mechanical Systems, 23, 23, pp. 768-770, (2014)
  • [6] Li X., Li M., Wang L., Et al., Modeling and analysis of the air damping for perforated structures in MEMS gyroscopes, MEMS and Sensors, 49, 11, pp. 749-754, (2012)
  • [7] Chen D., Cao M., Wang J., Et al., Fabrication and wafer-level vacuum packaging of MEMS resonant pressure sensor, Optics and Precision Engineering, 22, 5, pp. 1235-1242, (2014)
  • [8] Shi R., Qiu A., Su Y., Implementation and experiments of micromechanical differential silicon resonant accelerometer, Optics and Precision Engineering, 18, 12, pp. 2583-2589, (2010)
  • [9] Wang J., Shang Y., Chen D., Et al., Closed-loop control of a SOI-MEMS resonant accelerometer with electromagnetic excitation, Nanotechnology and Precision Engineering, 10, 4, pp. 322-326, (2012)
  • [10] Shi Q., Su Y., Qiu A., Et al., Device level vacuum packaging technologies of MEMS gyroscope, Optics and Precision Engineering, 17, 8, pp. 1987-1992, (2009)
12