Design of epoxy composites via molecular orbital modulation and enhanced π- π F interactions achieving synchronous improvement of electrical and mechanical performance

The stacked aromatic rings in bisphenol A epoxy resins provide good mechanical properties and thermal stability while leading to the transport of conjugated delocalized electrons, which dramatically affects the insulation properties of the material. This contradiction leads to performance bottlenecks in epoxy-based encapsulation materials, further limiting the development of high-voltage semiconductor devices. In this study, fluorophenylmodified epoxy monomers (FPMEPs) are designed to enrich the intermolecular interactions in an aromatic system while inhibiting the charge transport process, thereby solving the contradiction between the electrical and mechanical properties. Firstly, FPMEP with high insulation properties was designed by theoretical calculations and then synthesized by highly selective click chemistry. The fluorophenyl modulates the molecular orbitals of epoxy monomers and acts as a deep trap to inhibit charge injection and transport processes. Further, the pi-pi F stacking between the aromatic system and fluorophenyl enhances the interaction of the matrix molecules and solves the dispersion problem of fluorinated graphene (FG) fillers. The FPMEP/FG composites thus exhibit a considerable improvement in electrical and mechanical properties (breakdown strength of 39.8 kV/mm, dielectric loss of 0.011@50 Hz, tensile strength of 68.8 MPa, and adhesive strength of 2.15 MPa), and demonstrate good water repellency and aging durability. This matrix-filler synergistic modification strategy provides new insights into the design of insulation material.