Research Progress of Liquid-Cooled Pin-Fin Heatsinks for Power Electronic Devices

被引：0
|
作者：
Tian, Xiaofei [1 ,2 ,3 ]
Wnag, Linshan [1 ,2 ,3 ,4 ,5 ]
Liang, Xuebing [1 ,2 ,3 ,4 ,5 ]
Zheng, Fengshi [1 ,2 ,3 ,4 ,5 ]
Hu, Qiang [1 ,2 ,3 ,4 ,5 ]
机构：
[1] Metal Powder Materials Industrial Technology Research Institute of China GRINM Group Co., Ltd., Beijing,101407, China
[2] GRINM Additive Manufacturing Technology Co., Ltd., Beijing,101407, China
[3] General Research Institute for Nonferrous Metals, Beijing,100088, China
[4] GRIPM Advanced Materials Co., Ltd., Beijing,101407, China
[5] Beijing Engineering Research Center of Metal Powder, Beijing,101407, China
来源：
Cailiao Daobao/Materials Reports | 2024年 / 38卷 / 21期
关键词：
This work was financially supported by National Key R & D Program of China (2021YFB3701902); the Beijing Municipal Science & Technology Commission's Project (Z221100005822001); and Metal Powder Materials Proof-of-Concept Platform Project;
D O I：
10.11896/cldb.23070138
中图分类号：
学科分类号：
摘要：
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