Parameter Optimization of Laser Drilling for Through-Glass Vias Based on Deep Learning and Bayesian Algorithm

被引：0
|
作者：
Ouyang, Yuhang [1 ]
Hou, Dongyang [1 ]
Lv, Ting [1 ]
Dong, Fang [1 ]
Liu, Sheng [1 ]
Zhao, Jianhui [2 ]
机构：
[1] Institute of Technological Sciences, Wuhan University, Wuhan,430072, China
[2] Wuhan University, School of Computer Science, Wuhan,430072, China
来源：
IEEE Transactions on Components, Packaging and Manufacturing Technology | 2024年 / 14卷 / 09期
关键词：
Glass lasers - Glass manufacture - Linear programming - Microelectronics - Nonlinear programming - Semiconducting glass - Semiconductor device manufacture;
D O I：
10.1109/TCPMT.2024.3446510
中图分类号：
学科分类号：
摘要：
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页码：1680 / 1691
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