Material removal mechanism in micro ultrasonic machining

被引：0
|
作者：
Wang J.
Shimada K.
Mizutani M.
Kuriyagawa T.
机构：
来源：
| 1600年 / Japan Society for Precision Engineering卷 / 82期
关键词：
Crack; Hard and brittle materials; Material removal mechanism; Smoothed particle hydrodynamics; Ultrasonic machining;
D O I：
10.2493/jjspe.82.422
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：422 / 425
页数：3
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